・Non-cyanide, acidic, immersion type of silver plating process.
・Possible to deposit on not only copper but also Electroless Ni-P plating film.
・Pre-dipping by DAIN SILVER EL-SPT is necessary.
・Can obtain uniform on Electroless Nickel-phosphate plating (6% phosphate).
・It is the most suitable plating on isolated pattern circuit bord which is difficult to carry current.