The DAIN Series: Advanced plating solutions using materials that are kinder on the environment.

From the very beginning, the Daiwa Kasei Group has specialized in metal finishing. We have been deeply involved in research for both tin and tin alloy plating solutions for applications in electronics and semiconductors. We have developed many creative products and sell them as the DAIN series. Furthermore, we were also the world’s first to successfully bring to market a non-cyanide silver plating solution and have also developed products like our lead-free plating solutions. Our technologies for applying plating solutions in ways that protect the environment are ranked at the top here in Japan.

• Top market share
  and better performance:
  Non-cyanide silver plating solutions
  

  Quality improvements have been ongoing since our non-cyanide silver plating solutions were first developed. The products now have the same efficiency as we saw when using cyanide baths and we’re pushing toward features that exceed those from the use of cyanide baths. The decision to not use cyanide in any way has lowered expenses for wastewater processing facilities and management costs. It has also improved working environments.

  Non-cyanide silver and alloy plating solutions

  

  Plating using a non-cyanide silver plating solution for semiconductor lead frames, etc.

• DAIN TINGOOD helps reduce
  barrel plating costs

  Using knowledge acquired in R&D for tin plating solutions, we have succeeded in developing a highly concentrated tin salt solution for organic acid electroplating. DAIN TINGOOD helps reduce the cost of barrel plating for customers, which otherwise requires the pouring of plating solution and, therefore, many ingredients for replenishment. In addition, we handle lead-free tin alloy plating, including tin-silver, tin-bismuth, and more.

  Tin and tin-alloy plating solutions

  

  The DAIN TINGOOD series offers an array of processes tailored to your specifications.

• Tarnish inhibiting solutions
  for silver and tin plating

  Our development of silver plating and tin plating solutions are integrated operations in our proactive efforts to develop and produce post-treatment processing solutions. The NEW DAIN Silver series of silver plating anti-tarnish and the VERZONE-DA series of tin plating anti-tarnish protect a metal surface from sulfurization and oxidation without any loss of metallic properties.

  Anti tarnish solution

  

  The NEW DAIN Silver series protect surface of silver plating from tarnish of sulfidation or oxidization.

• Bump plating solutions for
  semiconductor surface finishing

  Before any other companies, we commercialized bump plating chemicals used for image processing LSIs in smartphones and other devices. As mobile devices become more compact and run faster, we will deliver plating solutions for even denser mounting.

  

  Bump plating solution for surface finishing of semiconductors, etc.

• Ginpikatto-P: using foam power to remove discolorations

  Silver and gold are widely used as both fashion and jewelry accessories and as industrial parts.Those metals will tarnish and lose their luster, however, when left exposed to the air for long periods of time. Ginpikatto-P is a tarnish remover that clears away discoloration without damaging the surface of the products it is used on.

  Ginpikatto-P

  

  Ginpikatto-P.