
Features
・Additive for organic acid, and sulfuric acid tin plating bath.
・Uniform semi bright appearance at wide current density.
・Economical low electrical consumption.
・Excellent reflow properties and solder wettability.
・Additive for organic acid, and sulfuric acid tin plating bath.
・Uniform semi bright appearance at wide current density.
・Economical low electrical consumption.
・Excellent reflow properties and solder wettability.