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Features
・Non-cyanide Copper and Tin alloy plating bath based as sulfuric acid.
・Obtain stable depositin rate of Cu/Sn = 60/40 to 40/60.
・Used as replacement of Nickel plating.
・Uniform high bright appearance.
・Non-cyanide Copper and Tin alloy plating bath based as sulfuric acid.
・Obtain stable depositin rate of Cu/Sn = 60/40 to 40/60.
・Used as replacement of Nickel plating.
・Uniform high bright appearance.